Name: Teradyne Connection Systems 

Address: 44 Simon Street  

City: Nashua, N.H. 03060   

Phone Number: (603) 879-3000   

CEO:  Michael A. Bradley

Products: Electronics

  Teradyne Connection Systems (TCS), a division of Teradyne, Inc., is the leader in high-performance connection systems, designing and manufacturing backplane systems, printed circuit boards and the industry’s leading high-speed, high-density connectors. TCS solves system design challenges with integrated interconnect solutions for application in the networking, communications, storage, computer server, and military/aerospace markets.

  Because technology never stops, innovation is the cornerstone at Teradyne. Engineers in the field and in product development work closely with customers to understand their technology needs now and in the future. Teradyne anticipates and develops products that meet next generation requirements today.

  TCS has a long history of technology advancements, including:

  •Inventing ‘eye of the needle’ compliant pin and NAFI fork and blade.

  •Pioneering industry’s first modular high-density connector (HD+®).

  •Designing the VHDM® family of high-speed, high-density interconnect products. VHDM quickly becomes the de-facto industry standard with billions of pins installed worldwide.

  •Launching the industry’s first commercially successful connector optimized for high speed differential applications (VHDM-HSD) at speeds greater than 5.0 Gb/s.

  •Introducing the NeXLev parallel board-to-board connector with unique BGA attachment technology for the highest reliability.

Global connection – local support

  Teradyne Connection Systems locates its high-volume manufacturing sites to provide the most value to its customers. Its business and technology centers in North America and Europe focus on developing leading edge connector and printed circuit board technology and speeding new products to market. TCS is headquartered in Nashua, N.H. with business and technology centers located there and in Winston-Salem, N.C. and Dublin, Ireland. High volume manufacturing facilities are located in Mexicali, Mexico, Penang, Malaysia and Shanghai, China. TCS provides sales and applications engineering support around the world.

High-speed, high-density connectors

  Teradyne’s broad range of connector product families enables design engineers to achieve their performance targets. Whether the priority is a proven cost-optimized solution or the best performing connector on the market, Teradyne is your source for reliable high-speed and high-density connectors.

  Teradyne offers a suite of backplane connectors to meet system requirements, including GbX, VHDM-HSD, VHDM, and HDM. Utilized for traditional right-angle interface of printed circuit boards, these high-density connectors offer design flexibility and unmatched performance and reliability. Its GbX L-Series, VHDM L-Series and VHDM H-Series connectors provide additional flexibility and backwards compatibility to deliver cost-optimized performance.

  For parallel connection of printed circuit boards, Teradyne offers NeXLev, VHDM Stacker, and HDM Stacker. Relocate high pin count devices onto mezzanine or module cards to simplify board routing, improve reliability and lower cost, without compromising system performance.

  Teradyne’s VHDM Right-Angle Male (RAM) connector provides a co-planar connector solution, allowing designers the flexibility to grow their systems horizontally or add new cabling solutions.

  Designed for applications where fiber density is paramount, Teradyne’s HD-Optyx optical connector is highly modular and can be quickly configured to accommodate a wide array of applications.

  In 2005, Teradyne added Aptera and GbX 2-pair to its wide array of connector product families. These connectors provide low-profile, high-performance solutions for difficult packaging challenges.

High performance circuits

  Teradyne Connection Systems manufactures high-technology, high-reliability printed circuit boards in its North American plant and manages cost-effective global sourcing for high-volume production. Its capabilities are among the world’s broadest and most advanced, including experience with a wide variety of materials to enable increasing signal speeds, deep microvias, buried, blind and backdrilled vias, sequential lamination, panel sizes from 16" x 18" up to 24" x 54", layer counts to 60+ and board thicknesses up to .500". Teradyne’s printed circuit fabrication facility is MIL-PRF-31032/1A, /2, MIL-P-55110 and ITAR certified.

Backplane system solutions

  PCB design, materials, choice of backplane connector and other enabling technologies play a crucial role in determining the success of any system. Teradyne’s experienced applications engineers can assist in the early stages of your backplane assembly design and, along with prototype and quick turn services, speed you to market with the right product the first time. With large format manufacturing capabilities, thru-hole soldering and reliable, repeatable press-fit assembly, no one is better at putting the pieces together than Teradyne.

  As bandwidth demands increase, the challenge is to balance greater performance requirements with lower overall system costs. Teradyne’s unique combination of in-depth system expertise and broad spectrum of high-performance interconnect products helps meet this challenge head on with real world solutions. Early in the design cycle, Teradyne help customers understand important design trade-offs. System designers can get the information real-time, using our proprietary tools on-line at the DesignLink website or work directly with our applications engineers around the world.

Total Quality Management

  Teradyne founder Alex d’Arbeloff deployed Total Quality Management (TQM) at Teradyne in 1990 in order to increase the company’s focus on customer satisfaction and continuous improvement. Today, Teradyne’s continued commitment to TQM enables the company to meet or exceed expectations the first time, every time. Teradyne continues to adapt TQM methodologies to make rapid improvements, introduce new processes and bring the latest in technology to market. In 2003, TCS added Six Sigma tools to its active TQM program.

  At Teradyne, the corporate culture rests on respect for each other and customers. With meteoric change being the nature of the industries served, Teradyne’s success depends on its nimbleness – its company-wide ability to respond to and anticipate change. Teradyne fosters an entrepreneurial environment where innovation grows and leading edge technology thrives.